Table of Contents

Title Page

Copyright

Foreword

Contributors

Chapter 1: Fundamentals of Micro-manufacturing

1.1 Introduction

1.2 Micro-forming (Micro-scale Deformation Processes)

1.3 Micro-machining for Discrete Part Micro-manufacturing

References

Chapter 2: Micro-Fabrication Processes in Semiconductor Industry

2.1 Introduction

2.2 Semiconductor Substrates

2.3 Chemical Vapor Deposition (CVD)

2.4 Lithography

2.5 Physical Vapor Deposition (PVD)

2.6 Dry Etching Techniques

2.7 Wet Bulk Micro-machining

2.8 Summary

References

Chapter 3: Modeling and Analysis at Micro-scales

3.1 Introduction

3.2 Limitation of Continuum Models at Micro-scales

3.3 Modified Continuum Models

3.4 Molecular Dynamics Models and Disadvantages

3.5 Examples of Micro-scale Modeling Approaches and Cross-Comparisons

3.6 Summary, Conclusions and Remaining Research Issues

Chapter 4: Metrology, Inspection, and Process Control in Micro-scales

4.1 Introduction

4.2 Spatial Metrology

4.3 Digital Holographic Microscope Systems

4.4 Micro Coordinate Measuring Machines—μCMM

4.5 Scanning Probe Microscopy

4.6 Metrology of Mechanical Properties

References

Chapter 5: Micro-Layered Manufacturing

5.1 Introduction

5.2 Layered Manufacturing Processes

5.3 Materials and Layered Manufacturing Capabilities

5.4 Applications of Layered Manufacturing Technologies

5.5 Future Directions

References

Chapter 6: Micro-laser Processing

6.1 Introduction

6.2 Laser Radiation, Absorption, and Thermal Effects

6.3 Laser Processing of Materials

6.4 Laser Processing Parameters

6.5 Ultrashort-Pulsed Laser Ablation

6.6 Nanosecond-Pulsed Laser Ablation

6.7 Laser Shock Peening

References

Chapter 7: Polymer Micro-molding/Forming Processes

7.1 Introduction

7.2 Polymers for Micro-Molding

7.3 Taxonomy of Micro-Molding Processes

7.4 General Process Dynamics of Micro-Molding

7.5 Micro-Injection Molding

7.6 Hot Embossing

7.7 Micro-Mold Fabrication

7.8 Summary and Ongoing Research

References

Chapter 8: Mechanical Micro-machining

8.1 Introduction

8.2 Material Removal at Micro-scale

8.3 Tool Geometry, Tool Wear, and Tool Deflections

8.4 Micro-turning

8.5 Micro-End-Milling

8.6 Micro-Drilling

8.7 Micro-Grinding

8.8 Micro-Machine Tools

References

Chapter 9: Micro-forming

9.1 Introduction

9.2 Micro-forging

9.3 Micro-embossing/Coining

9.4 Micro-extrusion

9.5 Micro-bending

9.6 Micro-stamping

9.7 Micro-Deep Drawing

9.8 Micro-hydroforming

9.9 Equipment and Systems for Micro-forming Applications

9.10 Summary and Future Work

References

Chapter 10: Micro-Electro Discharge Machining (μEDM)

10.1 Introduction

10.2 The Micro-EDM Process

10.3 Micro-EDM Process Control Parameters

10.4 Micro-EDM Process Performance Measurements

10.5 Micro-EDM Process Applications and Examples

10.6 Recent Developments and Research on Micro-EDM

10.7 Summary

References

Chapter 11: Metal Injection Molding at Micro-Scales (μMIM)

11.1 Introduction to Metal Injection Molding (MIM)

11.2 Micro Metal Injection Molding (μMIM)

11.3 Feedstock Preparation

11.4 Injection Molding

11.5 Debinding

11.6 Sintering

11.7 Summary

References

Bplates

Index

Copyright © 2010 by John Wiley & Sons, Inc. All rights reserved.

Published by John Wiley & Sons, Inc., Hoboken, New Jersey.

Published simultaneously in Canada.

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Library of Congress Cataloging-in-Publication Data:

Includes index.

ISBN 978-0-470-55644-3

Foreword

Since early 1990s, there has been an increasing demand for compact, integrated and miniature products for use in our daily lives as well as for industrial applications. Consumer products that we use and interact with every day are not only continuously getting smaller, but also are loaded with more integrated multi-functionalities. Similar trends have also taken place in other devices such as portable and distributed power generation devices (batteries, fuel cells, micro-turbines), electronic cooling systems, medical devices (pace makers, catheters, stents), sensors, etc. As a consequence, components for such devices and systems also get smaller down to micro/meso-scales, with a near future expectation into nano-scales. Micro-fabrication techniques for silicon materials have been well established and utilized in manufacturing of micro-electronics devices. There have been hundreds, if not thousands, of books written about semiconductors, micro-electronics and related micro-fabrication processes. Hence, their adaptation is apparent for systems such as Micro-Electromechanical-Systems (MEMS) for use in aforementioned miniature devices and products. However, these techniques are mostly limited to silicon as a starting material. When complex and integrated products are required, for cost effective design and use of metallic components, thus far, well-known macro-fabrication methods such as forming and machining were adapted into micro/meso-scales mainly using intuition and experience.

In this work, a collection of esteemed authors from a broad range of backgrounds and institutions worldwide has prepared, possibly one of the first extensive books on micro-manufacturing processes for mainly non-silicon materials. The main goal was to gather the experience, technological know-how and scientific findings in a wide variety of topics and applications in a synergistic and coherent book for the benefit of students, researchers, engineers, managers and teachers who would start their investigations studies, preparations or careers with a concise set of information.

The first chapter, written by Drs. M. Koç and T. Özel, summarizes the recent developments and findings on micro-manufacturing, including the size effects, applications, tooling, etc., reported in the literature with examples and applications. In the second chapter, prepared by Dr. K. Teker, a summary of well-known micro-fabrication methods for silicon materials is presented to allow readers to compare them with the processes described in the rest of the book. The third chapter, which is prepared by Drs. T. Makino and K. Dohda, describes the issues in modeling and analysis for micro-manufacturing processes along with a comparison of different modeling approaches. Drs. O. Karhade and T. Kurfess present metrology, inspection and quality control aspects at micro-scales, and describe alternative methods to do so. Dr. A. Bandyophadyay and his colleagues discuss micro-layered manufacturing processes to be used for medical devices, sensors, etc. made out of metals and plastics in Chapter 5. In Chapter 6, Dr. Wu and Dr. Özel describe some of the micro-manufacturing processes based on laser processing with several examples and discuss long and short pulsed laser-material interactions. Micro Injection Molding process for polymers is presented by Dr. Yao in Chapter 7 while Micro-mechanical Machining is introduced in Chapter 8 by Dr. Özel and his associate. Dr. Koç prepared Chapter 9 with his colleague Dr. Mahabunphachai on micro-forming processes such as micro-forging, micro-stamping, micro-hydroforming and size effects. Dr. Rahman and his group cover in Chapter 10 micro-EDM processes including descriptions of equipment development. Dr. Fu Gang explains the micro Metal Injection Molding process in Chapter 11 with several examples of applications.

We would like to thank all of the authors who contributed to this book. We also extend our thanks to Ms. Anita Lekhwani of John Wiley who assisted us in all stages of preparing this book for the publication.

MUAMMER KOÇ and TUĞRUL ÖZEL

June 2010

Contributors